Qualcomm Engineering Internship – 2024 & 2025 Graduates

Qualcomm Off Campus Drive 2024 for Engineering Internship. Candidates with a B.E., B.Tech., or M.E./M.Tech. degree are eligible to apply. The entire qualifications and application process are outlined below.

Qualcomm Engineering Internship – 2024 & 2025 Graduates

About the Company:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.

Requirements:

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Science Engineering, Communication Engineering, Electronics & Communications Engineering
• Graduating in 2024 or 2025
• Software Engineering Intern:
  • Graduating in 2024
  • Must be available for 2 or 6 months starting immediately
  • Good understanding of OS concepts, Data structures, etc
  • C/C++ and object oriented design
  • Development of real-time embedded software and device drivers
  • Mobile SW development for Windows Mobile, Android or Linux
  • Linux/UNIX, Linux Drivers, Linux Kernel Development
• Hardware Engineering Intern:
  • Graduating in 2025
  • Must be available for 11 months internship from July’24-June’25.
  • Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs
  • Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
  • Knowledge of VLSI, wireless/wired communications and protocols or graphics/video multi-media
  • Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design

How to Apply for Qualcomm Off Campus Drive 2024?

Interested and qualified candidates can apply for this drive online using the link provided below.