Principal Packaging Engineer

Principal Packaging Engineer Overview

We are seeking a Principal Packaging Engineer to join our team in Newport, Wales. This role offers an exciting opportunity to lead the design and development of cutting-edge advanced packaging technologies, with a competitive salary of up to £74,000 and a strong emphasis on work-life balance.

Key Responsibilities:

• Lead the design and development of advanced packaging technologies, focusing on innovative 3D/2.5D solutions from initial concept through to prototype.
• Oversee the design, assembly, testing, and validation processes for advanced packaging demonstrators.
• Define technology roadmaps and manage multiple packaging projects simultaneously.
• Collaborate with both internal teams and external partners to address system-level integration challenges.
• Represent the company in technical forums, proposals, and collaborative bids.

Qualifications:

• Demonstrated experience in advanced semiconductor packaging, specifically in 3D/2.5D technologies.
• Extensive knowledge of design, modeling, assembly, and validation processes related to packaging.
• Proficiency in signal and power integrity as well as thermal management.
• Strong communication, leadership, and problem-solving abilities.
• Proven track record of delivering demonstrators and leading cross-functional teams.

Benefits:

• 15% pension contribution, with 10% provided by the employer.
• Annual bonus based on performance.
• Private medical insurance that extends to family members.
• Visa sponsorship available for eligible candidates.
• Relocation assistance of up to £4000.

If you are looking for a strategic, hands-on role that aims to define and deliver next-generation packaging for AI applications, please reach out to Ella Flynn at IC Resources.

Degree Requirement: Not Specified

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